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Guidelines for acceptable finishes, including Hot Air Solder Leveling (HASL), Immersion Tin, Immersion Silver, and OSP (Organic Solderability Preservatives). Force Profiles

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The standard outlines specific test schedules to validate performance, including:

The official IEC 60352-5 document is copyrighted material protected under international laws. Authorized Channels

: The bending test was removed as it was deemed no longer common, while new requirements for documenting press-in and push-out forces were added.

: Updates reflect the use of a wider range of board materials beyond standard printed circuit boards.

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