"Still at it?" Sarah asked, leaning against his cubicle wall with a lukewarm coffee.
To maximize routing space on dense boards, designers frequently place vias directly into the BGA land pads. IPC-7095 outlines the strict manufacturing requirements for this technique. Unfilled or improperly filled vias act as capillary tubes, sucking solder away from the BGA ball during reflow, resulting in open circuits or weak joints. The standard guides engineers on proper via-plugging, capping, and plating protocols to prevent these assembly defects. 3. Thermal Management and Reflow Profiling ipc7095 pdf link
For those who cannot access the PDF immediately, here are critical rules from the document that you can apply today: "Still at it