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Stack microvias for space savings, or stagger them to reduce stress. Via-in-Pad Plated Over (VIPPO)
This module covers the "art of black magic" demystified: Advanced Hardware and PCB Design Masterclass 20...
While the masterclass project is based on an RK3399 processor, its principles are future-proof. Stack microvias for space savings, or stagger them
Leave clear component clearance zones for robotic pick-and-place nozzles. Stack microvias for space savings
Dense layouts generate intense localized heat. Active and passive thermal management prevents component failure.
Use a strategic mix of capacitor values (e.g., 10µF, 0.1µF, 1nF) to target different frequency ranges. Place the smallest capacitors closest to the IC power pins with minimal loop inductance. Minimizing Loop Inductance
👇 Comment below or DM if you want a link to the course syllabus.